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ESD Clamp Diode Selection

Calculate ESD clamp diode peak current, power dissipation, and clamping ratio to verify protection for IEC 61000-4-2 compliance.

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Formula

I_pk = (V_ESD − V_cl) / Z, P_pk = V_cl × I_pk

V_clClamp voltage (V)
ZDischarge path impedance (Ω)

How It Works

ESD (electrostatic discharge) clamp diodes protect sensitive ICs from voltage transients exceeding their maximum ratings. In a typical ESD event (IEC 61000-4-2 Level 4: ±8 kV contact), the discharge current flows through the series path impedance Z (typically 330 Ω for the HBM or contact-discharge model). The peak clamp current is I_pk = (V_ESD − V_cl) / Z, where V_cl is the clamping voltage of the TVS diode at peak current. The peak power dissipated in the clamp is P_pk = V_cl × I_pk. For the IC to survive, the clamped voltage (V_cl) must remain below the IC's absolute maximum rating. The clamping ratio V_cl/V_ESD indicates how efficiently the device clamps. A low ratio (< 0.01) means effective clamping.

Worked Example

Problem
An IEC 61000-4-2 Level 2 contact ESD event (V_ESD = 4 kV) strikes a USB line protected by a TVS clamp with V_cl = 15 V and 330 Ω series impedance. Calculate peak current, peak power, and clamping ratio.
Solution
1. Peak current: I_pk = (4000 − 15) / 330 = 3985 / 330 = 12.1 A 2. Peak power: P_pk = 15 × 12.1 = 181 W 3. Clamping ratio: V_cl/V_ESD = 15/4000 = 0.00375 Result: The TVS clamp dissipates 181 W peak (but only for ~1 ns), clamping the line to 15 V. Verify the IC tolerates 15 V on the protected pin. The low clamping ratio (0.37%) confirms effective suppression.

Practical Tips

  • For IEC 61000-4-2 Level 4 (±8 kV), select a TVS with a peak pulse current rating ≥ 15 A (at the relevant pulse width) with adequate margin.
  • Use multi-channel TVS arrays for interfaces with many pins (USB, HDMI, Ethernet) to save board space and reduce routing inductance.
  • Add a small series resistor (10–47 Ω) between the connector and TVS to reduce dV/dt stress on the TVS and help meet ESD limits.

Common Mistakes

  • Selecting a TVS diode based on standoff voltage alone without checking the clamping voltage at peak current — V_cl is always higher than the standoff voltage.
  • Ignoring the capacitance of the TVS diode on high-speed lines — a low-capacitance TVS (< 0.5 pF) is required for USB 3.0 or HDMI.
  • Placing the ESD clamp far from the connector — every mm of trace between the connector and clamp allows the ESD spike to propagate. Place clamps within 2 mm of the connector.

Frequently Asked Questions

ESD TVS clamps are optimised for very fast rise times (< 1 ns) and high peak currents (1–30 A) in very short pulses (< 100 ns). Surge TVS handles longer pulses (milliseconds) with higher energy. Both are bidirectional TVS diodes but sized for different threat profiles.
IEC 61000-4-2 (contact discharge) uses a 330 Ω / 150 pF model with a faster rise time (~1 ns) and higher peak current than the Human Body Model (HBM, 1500 Ω / 100 pF). IEC 61000-4-2 is harsher and is used for system-level testing, while HBM is used for component-level testing.
Not recommended. Zener diodes are not optimised for fast transients — they have slow response times (typically > 10 ns) compared to TVS diodes (< 1 ns). For ESD protection use a TVS rated for the specific ESD model and energy level.

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