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Motor

H-Bridge MOSFET Selection

Calculate H-bridge MOSFET requirements including peak current, conduction losses, and minimum current rating for DC motor drivers.

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Formula

I_peak = I_rated × k, P_cond = I²× R_DS(on)

kInrush multiplier (×)
R_DSMOSFET on-resistance (Ω)

How It Works

An H-bridge is a power circuit consisting of four switches (typically MOSFETs) arranged to allow bidirectional current through a DC motor. By turning diagonal pairs ON, the bridge drives current in either direction, enabling forward, reverse, and braking. Key selection parameters are: continuous drain current (I_D) ≥ 1.5× motor rated current, drain-source voltage rating (V_DS) ≥ 2× supply voltage, on-state resistance (R_DS(on)) to minimise conduction losses, and gate charge (Q_g) compatible with the gate driver's drive capability.

Worked Example

Select MOSFETs for an H-bridge driving a 24 V, 10 A continuous motor with 30 A peak inrush. Step 1 — Voltage rating (2× derating): V_DS ≥ 2 × 24 = 48 V → use 60 V rated MOSFETs Step 2 — Current rating (1.5× continuous + handle peak): I_D_cont ≥ 1.5 × 10 = 15 A continuous I_D_peak ≥ 30 A (for inrush) → Select a MOSFET rated 40 A continuous / 100 A peak Step 3 — Conduction loss per MOSFET at rated current: Assume R_DS(on) = 8 mΩ at 100 °C (e.g., IRFB3207) P_cond = I² × R_DS(on) = 10² × 0.008 = 0.8 W per FET Total for 4 FETs (2 conducting at any time): 2 × 0.8 = 1.6 W Step 4 — Gate driver requirement: Q_g = 70 nC (typical for this FET class) At 20 kHz PWM, gate drive power: P_g = Q_g × V_gs × f = 70e-9 × 12 × 20000 = 16.8 mW per FET → negligible Step 5 — Dead time requirement: t_dead > t_fall + margin = 50 ns + 20 ns = 70 ns minimum (set 100 ns) Result: 60 V / 40 A MOSFETs with R_DS(on) < 10 mΩ (e.g., IRFB3207, STP60NF06) are suitable. Add a dedicated gate driver IC (e.g., IR2104) with bootstrap high-side drive.

Practical Tips

  • Use a dedicated H-bridge gate driver IC (e.g., DRV8876, L298N, IR2104) rather than discrete logic — they provide shoot-through protection, dead-time insertion, and proper high-side bootstrap drive
  • Place 100 nF ceramic decoupling capacitors as close as possible to each MOSFET drain-source to suppress switching transients; add a bulk 100–470 µF electrolytic across the supply rails
  • For integrated H-bridge ICs (L298N, DRV8833), check the R_DS(on) of the internal switches — many integrated drivers have 1–3 Ω on-resistance, causing significant voltage drop and heating at currents above 2–3 A

Common Mistakes

  • Choosing MOSFETs rated exactly at supply voltage — voltage spikes from motor inductance switching (L×dI/dt) easily exceed the DC supply voltage; always derate V_DS to at least 2×
  • Omitting flyback (freewheeling) diodes — MOSFETs have body diodes that conduct during dead time, but high-speed discrete Schottky diodes reduce recovery time and switching losses in high-current applications
  • Using a single shared gate resistor for all four MOSFETs — each gate needs its own resistor to prevent parasitic oscillation and allow independent tuning of switching speed

Frequently Asked Questions

Shoot-through occurs when both the high-side and low-side MOSFETs in the same bridge leg are ON simultaneously, creating a short circuit from supply to ground. It is prevented by inserting a dead time (typically 50–200 ns) between turning one FET off and the other on. Modern H-bridge driver ICs implement dead time automatically.
Integrated H-bridge ICs (DRV8876, TB6612FNG, L298N) are convenient for currents up to 3–5 A and provide built-in protection. For motors above 5 A, discrete MOSFETs with a gate driver IC offer lower R_DS(on), better thermal management, and full flexibility over dead time and switching speed.
Gate drive losses, quiescent current of the driver IC, and leakage through the body diodes all contribute to idle heating. High-frequency PWM at high duty cycle near 50% maximises switching losses. Reducing PWM frequency to the minimum that avoids audible noise typically reduces driver heating substantially.

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