Calculadora de Temperatura de Pista PCB
Calcula la elevación de temperatura en pistas de cobre de PCB por efecto Joule a alta corriente.
Fórmula
ΔT = (I / (k × W^b))^(1/c) — IPC-2152
Referencia: IPC-2152 Table 5-1 (external layers)
Cómo Funciona
PCB copper trace temperature rise calculation is a critical aspect of power integrity and thermal management in electronic design. The IPC-2221 standard provides a comprehensive methodology for determining how much heat is generated in a copper trace when electrical current passes through it. The fundamental principle is based on the relationship between current density, trace cross-sectional area, and thermal dissipation. As current flows through a conductive path, resistive heating occurs, causing temperature increase. This temperature rise depends on multiple factors including trace geometry, copper weight, ambient temperature, and current magnitude. The standard provides empirical formulas that help engineers predict and manage thermal performance, ensuring reliable circuit operation and preventing potential failure modes related to excessive heating.
Ejemplo Resuelto
Consider a 1 oz copper trace on a standard FR-4 PCB with 1mm width carrying 2A of current. Using the IPC-2221 formula, first calculate the cross-sectional area (35μm thick for 1 oz copper). The temperature rise calculation involves determining the current carrying capacity based on the trace's cross-sectional area and material properties. For this scenario, the expected temperature rise would be approximately 15-20°C above ambient. Engineers would verify that this temperature increase remains within acceptable limits for the specific component and application, ensuring no risk of thermal degradation or performance compromise.
Consejos Prácticos
- ✓Always use the most recent IPC-2221 standard revision for calculations
- ✓Consider additional thermal management for high-current traces
- ✓Use thermal simulation software to validate manual calculations
Errores Comunes
- ✗Ignoring copper weight and trace width in thermal calculations
- ✗Assuming linear heat dissipation across all PCB materials
- ✗Neglecting ambient temperature and cooling conditions
Preguntas Frecuentes
What is the maximum safe temperature rise for PCB traces?
Typically, a temperature rise of 10-30°C is considered safe, depending on the specific PCB material and component requirements.
How does trace width affect current carrying capacity?
Wider traces have lower resistance and can carry more current with less temperature rise, improving thermal performance and reliability.
Can I use the same calculation for different copper weights?
No, copper weight significantly impacts the calculation. Always adjust formulas based on specific copper weight (oz/sq ft).
What factors influence trace temperature beyond current?
Ambient temperature, board material, trace length, and proximity to other heat-generating components all impact trace temperature.
How often should temperature rise calculations be performed?
Perform calculations during initial design and any significant design modifications, especially for power-critical circuits.
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