Calculadora de Temperatura de Unión

Calcula la temperatura de unión de semiconductores en función de la potencia disipada y las resistencias térmicas.

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Fórmula

T_J = T_A + P_D \cdot (\theta_{JC} + \theta_{CS} + \theta_{SA})

T_J — Junction temperature (°C)

T_A — Ambient temperature (°C)

P_D — Power dissipation (W)

θ_JC — Junction-to-case thermal resistance (°C/W)

θ_CS — Case-to-heatsink thermal resistance (°C/W)

θ_SA — Heatsink-to-ambient thermal resistance (°C/W)

Cómo Funciona

Junction temperature is a critical parameter in electronic thermal management that represents the actual temperature at the semiconductor junction of a device. It is calculated by considering the ambient temperature and the total thermal resistance path from the junction through various heat transfer mediums. Understanding junction temperature helps engineers predict and prevent potential device failure due to thermal stress.

Ejemplo Resuelto

Problem: Calculate the junction temperature for a power semiconductor with the following parameters: Ambient Temperature = 25°C, Power Dissipation = 10W, θJC = 1.5°C/W, θCS = 0.5°C/W, θSA = 2°C/W Solution: 1. Calculate total thermal resistance: θJA = 1.5 + 0.5 + 2 = 4°C/W 2. Compute junction temperature: Tj = 25°C + (10W * 4°C/W) = 25°C + 40°C = 65°C

Consejos Prácticos

✓Always use manufacturer-specified thermal resistance values
✓Consider worst-case ambient temperature scenarios
✓Include safety margins in thermal design calculations

Errores Comunes

✗Neglecting cumulative thermal resistance
✗Forgetting to account for ambient temperature
✗Using incorrect thermal resistance values for specific components

Preguntas Frecuentes

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