Standard PCB Thickness Guide
| Total Board Thickness | 0.4 · 0.8 · 1 · 1.6 · 2 · 2.4 · 3.2 mm |
| 1.6 mm | 62.99 mil = 0.063" |
Standard PCB thicknesses (0.8mm to 3.2mm) with layer count, use cases, and design considerations.
Industry Standard
De Facto Standard
1.6 mm = 62.99 mil = 0.063"
Recommendation
Use 1.6mm unless there is a specific requirement otherwise
Standard PCB Thicknesses
7 rows
| 0.4 mm | 15.7 | 0.016" | 2-4 layers typical |
| 0.8 mm | 31.5 | 0.031" | 2-6 layers typical |
| 1 mm | 39.4 | 0.039" | 2-6 layers typical |
| 1.6 mmstandard | 63.0 | 0.063" | 2-12 layers typical |
| 2 mm | 78.7 | 0.079" | 4-16 layers typical |
| 2.4 mm | 94.5 | 0.094" | 6-20 layers typical |
| 3.2 mm | 126.0 | 0.126" | 8-24+ layers typical |
Thickness Guidelines
Typical: 2-4 layers typical
Applications
- →Flex-rigid transition zones
- →Ultra-thin wearables
- →Smart cards (ISO 7810)
- →Memory cards
Advantages
- +Ultra-compact designs
- +Fits in thin enclosures
- +Lighter weight
Disadvantages
- −Very fragile — handle with care
- −Limited layer count
Specialty thickness for space-constrained applications. Requires careful handling during assembly. Not suitable for connectors or mechanical mounting points.
Typical: 2-6 layers typical
Applications
- →Compact consumer electronics
- →Portable devices
- →Bluetooth/Wi-Fi modules
- →SSD drives
Advantages
- +Half the weight of 1.6mm
- +Good for tight enclosures
- +Standard option at most fabs
Disadvantages
- −Reduced mechanical strength
- −May warp during reflow
Popular choice for portable electronics. Check connector datasheets — many assume 1.6mm boards. Use support fixtures during high-temp reflow.
Typical: 2-6 layers typical
Applications
- →Thin laptops and tablets
- →Compact IoT devices
- →Memory modules (DIMM)
- →Mini-ITX boards
Advantages
- +Good balance of thin and sturdy
- +Compatible with most connectors
- +Widely available
Disadvantages
- −Less rigid than 1.6mm
- −Limited layer count for HDI
Common in applications where 1.6mm is too thick but 0.8mm is too fragile. JEDEC DIMM standard. Many RF modules use 1.0mm.
Typical: 2-12 layers typical
Applications
- →General-purpose PCBs
- →Industrial controls
- →Desktop computer motherboards
- →Network equipment
Advantages
- +Industry standard — most widely supported
- +Excellent mechanical strength
- +Compatible with all connector types
Disadvantages
- −May be too thick for compact devices
- −Heavier than thin alternatives
The de facto standard PCB thickness. Always start with 1.6mm unless there is a specific requirement for thinner/thicker. All fabs support this, all connectors assume it, best pricing.
Typical: 4-16 layers typical
Applications
- →High layer count boards (10+ layers)
- →Backplanes
- →Heavy copper power boards
- →Industrial equipment
Advantages
- +Excellent rigidity
- +Accommodates more layers
- +Better heat spreading
Disadvantages
- −Heavier and larger
- −Higher material cost
Used when layer count or copper weight pushes beyond 1.6mm stackup limits. Common in datacenter and telecom backplanes.
Typical: 6-20 layers typical
Applications
- →High layer count backplanes
- →Server motherboards
- →Telecom infrastructure
- →Military/aerospace thick boards
Advantages
- +Maximum layer count capacity
- +Excellent mechanical strength
- +Good for large connectors
Disadvantages
- −Specialty thickness — longer lead time
- −Higher cost
Heavy-duty boards for infrastructure. Aspect ratio (thickness/hole diameter) becomes a constraint — 10:1 is typical limit, so minimum PTH is ~0.25mm.
Typical: 8-24+ layers typical
Applications
- →Large backplanes
- →Military specification boards
- →High-power RF amplifiers
- →Power distribution boards
Advantages
- +Maximum rigidity
- +Highest layer count
- +Best thermal mass for power
Disadvantages
- −Very heavy
- −Expensive
Extreme thickness for specialty applications. Minimum PTH diameter is ~0.3mm (12:1 aspect ratio). Often uses sequential lamination.
Related Calculators
Stackup Builder
Calculate trace widths for a target impedance on a 4-layer PCB stackup: microstrip on L1 over the L2 plane, stripline on L3 between the L2 and L4 planes. Enter the dielectric heights, dielectric constant and copper weight for 50 ohm or a custom Z0. Free, instant results.
Controlled Z
Calculate characteristic impedance for surface microstrip, embedded microstrip, and stripline PCB traces. Get Z0, effective Er, and target trace width. Free, instant results.
Microstrip Impedance
Calculate microstrip impedance using Hammerstad-Jensen equations. Get Z0, effective dielectric constant, and propagation delay for PCB trace design. Free, instant results.