Motor Driver Power Dissipation
Calculate motor driver IC or discrete MOSFET power dissipation including conduction loss and switching loss at a given PWM frequency.
Formula
How It Works
This calculator determines power dissipation and junction temperature in motor driver ICs from on-resistance, switching frequency, and thermal resistance parameters. PCB designers, embedded systems engineers, and thermal analysts use it to verify that driver ICs remain within safe operating temperature. Exceeding maximum junction temperature triggers thermal shutdown (typically at 150-175°C) and causes intermittent motor dropouts.
Per semiconductor physics, driver dissipation consists of conduction losses and switching losses: P_total = P_cond + P_sw. Conduction loss follows: P_cond = I² × R_DS(on) × D, where D is duty cycle. Switching loss approximates: P_sw ≈ 0.5 × V × I × (t_rise + t_fall) × f_sw. For typical 3A motor drivers at 20 kHz, conduction losses dominate (2-5W vs. 0.1-0.3W switching).
Junction temperature calculation per JEDEC JESD51: T_j = T_ambient + P_total × R_θJA. Manufacturer-specified R_θJA assumes minimal PCB copper (1 in² per JEDEC standard). With optimized thermal design—4-layer PCB, thermal vias, large copper pour—effective R_θJA reduces by 30-50%. The Texas Instruments DRV8876 (R_DS(on) = 565 mΩ, R_θJA = 35°C/W) at 3A continuous dissipates 5.1W and reaches 178°C junction in free air—exceeding its 150°C maximum. Proper PCB thermal design reduces R_θJA to 20-25°C/W, achieving safe 127-152°C operation.
Worked Example
Verify thermal performance for a DRV8833 dual H-bridge driving two 12V/1.5A motors. IC specifications: R_DS(on) = 320 mΩ (per H-bridge), R_θJA = 42°C/W (TSSOP-16), T_j max = 150°C. PWM frequency is 25 kHz, duty cycle 75%.
Step 1 — Calculate conduction losses per channel: P_cond = I² × R_DS(on) × D = 1.5² × 0.320 × 0.75 = 0.54W per channel Total for dual H-bridge: 0.54 × 2 = 1.08W
Step 2 — Estimate switching losses: Assuming t_sw = 50 ns rise + 50 ns fall: P_sw = 0.5 × 12 × 1.5 × (100e-9) × 25000 × 2 channels = 0.045W (negligible)
Step 3 — Calculate total dissipation: P_total = 1.08 + 0.045 + 0.02 (quiescent) = 1.15W
Step 4 — Determine junction temperature at 40°C ambient: T_j = T_amb + P × R_θJA = 40 + 1.15 × 42 = 88.3°C Margin to limit: 150 - 88.3 = 61.7°C — acceptable
Step 5 — Calculate maximum allowable current: P_max for 150°C at 40°C ambient: (150-40)/42 = 2.62W I_max = √(P_max / (R_DS(on) × D × 2)) = √(2.62/(0.32×0.75×2)) = 2.34A per channel
Result: At 1.5A per motor and 75% duty cycle, junction reaches 88°C—well within limits. The driver can handle up to 2.3A per channel before thermal shutdown at 40°C ambient. Adding thermal vias (reduces R_θJA to 30°C/W) allows 2.7A operation.
Practical Tips
- ✓Per Texas Instruments layout guidelines, expose thermal pads on QFN/DFN packages and connect with at least 9 thermal vias (0.3mm diameter) to inner ground plane—reduces R_θJA by 30-40%
- ✓Measure IC surface temperature with IR thermometer during initial testing: surface >85°C indicates junction near limits; >100°C surface requires immediate PCB redesign per reliability guidelines
- ✓For currents >5A, consider discrete MOSFETs (R_DS(on) < 10 mΩ available in TO-220) instead of integrated drivers (50-500 mΩ typical)—external FETs dissipate 10-50× less power at same current
Common Mistakes
- ✗Using bare R_θJA from datasheet without considering PCB: Per JEDEC JESD51, R_θJA is measured on minimal copper; a 4-layer PCB with thermal vias and ground plane reduces effective R_θJA by 30-50%, enabling 1.5× higher current
- ✗Ignoring duty cycle in power calculations: At 50% duty cycle, conduction loss is half that of 100% duty cycle—a driver hot at 90% duty may be cool at 50%, allowing higher peak current for PWM-controlled speed
- ✗Calculating peak power instead of average: Per thermal dynamics, junction temperature responds to average power (thermal time constant is 10-100 ms); use RMS current for accurate thermal analysis in PWM applications
Frequently Asked Questions
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