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Standard PCB Thickness Guide

Standard PCB thicknesses (0.8mm to 3.2mm) with layer count, use cases, and design considerations.

Industry Standard

De Facto Standard

1.6 mm = 62.99 mil = 0.063"

Recommendation

Use 1.6mm unless there is a specific requirement otherwise

Standard PCB Thicknesses

Thickness (mm)milinchLayer Count
0.4 mm15.70.016"2-4 layers typical
0.8 mm31.50.031"2-6 layers typical
1 mm39.40.039"2-6 layers typical
1.6 mmstandard63.00.063"2-12 layers typical
2 mm78.70.079"4-16 layers typical
2.4 mm94.50.094"6-20 layers typical
3.2 mm126.00.126"8-24+ layers typical

Thickness Guidelines

0.4 mm(15.7 mil / 0.016")

Typical: 2-4 layers typical

Applications

  • ->Flex-rigid transition zones
  • ->Ultra-thin wearables
  • ->Smart cards (ISO 7810)
  • ->Memory cards

Advantages

  • +Ultra-compact designs
  • +Fits in thin enclosures
  • +Lighter weight

Disadvantages

  • -Very fragile — handle with care
  • -Limited layer count

Specialty thickness for space-constrained applications. Requires careful handling during assembly. Not suitable for connectors or mechanical mounting points.

0.8 mm(31.5 mil / 0.031")

Typical: 2-6 layers typical

Applications

  • ->Compact consumer electronics
  • ->Portable devices
  • ->Bluetooth/Wi-Fi modules
  • ->SSD drives

Advantages

  • +Half the weight of 1.6mm
  • +Good for tight enclosures
  • +Standard option at most fabs

Disadvantages

  • -Reduced mechanical strength
  • -May warp during reflow

Popular choice for portable electronics. Check connector datasheets — many assume 1.6mm boards. Use support fixtures during high-temp reflow.

1 mm(39.4 mil / 0.039")

Typical: 2-6 layers typical

Applications

  • ->Thin laptops and tablets
  • ->Compact IoT devices
  • ->Memory modules (DIMM)
  • ->Mini-ITX boards

Advantages

  • +Good balance of thin and sturdy
  • +Compatible with most connectors
  • +Widely available

Disadvantages

  • -Less rigid than 1.6mm
  • -Limited layer count for HDI

Common in applications where 1.6mm is too thick but 0.8mm is too fragile. JEDEC DIMM standard. Many RF modules use 1.0mm.

1.6 mm(63.0 mil / 0.063")recommended

Typical: 2-12 layers typical

Applications

  • ->General-purpose PCBs
  • ->Industrial controls
  • ->Desktop computer motherboards
  • ->Network equipment

Advantages

  • +Industry standard — most widely supported
  • +Excellent mechanical strength
  • +Compatible with all connector types

Disadvantages

  • -May be too thick for compact devices
  • -Heavier than thin alternatives

The de facto standard PCB thickness. Always start with 1.6mm unless there is a specific requirement for thinner/thicker. All fabs support this, all connectors assume it, best pricing.

2 mm(78.7 mil / 0.079")

Typical: 4-16 layers typical

Applications

  • ->High layer count boards (10+ layers)
  • ->Backplanes
  • ->Heavy copper power boards
  • ->Industrial equipment

Advantages

  • +Excellent rigidity
  • +Accommodates more layers
  • +Better heat spreading

Disadvantages

  • -Heavier and larger
  • -Higher material cost

Used when layer count or copper weight pushes beyond 1.6mm stackup limits. Common in datacenter and telecom backplanes.

2.4 mm(94.5 mil / 0.094")

Typical: 6-20 layers typical

Applications

  • ->High layer count backplanes
  • ->Server motherboards
  • ->Telecom infrastructure
  • ->Military/aerospace thick boards

Advantages

  • +Maximum layer count capacity
  • +Excellent mechanical strength
  • +Good for large connectors

Disadvantages

  • -Specialty thickness — longer lead time
  • -Higher cost

Heavy-duty boards for infrastructure. Aspect ratio (thickness/hole diameter) becomes a constraint — 10:1 is typical limit, so minimum PTH is ~0.25mm.

3.2 mm(126.0 mil / 0.126")

Typical: 8-24+ layers typical

Applications

  • ->Large backplanes
  • ->Military specification boards
  • ->High-power RF amplifiers
  • ->Power distribution boards

Advantages

  • +Maximum rigidity
  • +Highest layer count
  • +Best thermal mass for power

Disadvantages

  • -Very heavy
  • -Expensive

Extreme thickness for specialty applications. Minimum PTH diameter is ~0.3mm (12:1 aspect ratio). Often uses sequential lamination.

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