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Thermal Via Array Calculator

POSThttps://rftools.io/api/py/v1/calculate

Slug thermal-via-array. Calculate thermal resistance of a PCB thermal via array for heat spreading from SMD packages to inner copper planes or heatsinks.

Inputs

Send every one of these in inputs, in the units shown. Most are required: a call without one is refused (400) and costs nothing; one the calculator can do without takes the default shown. An input outside its range is still computed and flagged in the provenance.

Inputs of thermal-via-array
NameUnitRangeDefaultDescription
numViasnumbervias1 … 100009Total number of thermal vias in the array
viaDiameternumbermm0.05 … 50.3Via drill hole diameter. IPC-7093 recommends 0.2–0.4mm for thermal vias.
platingThicknessnumberμm1 … 20025Via barrel copper plating thickness. Typical PCB: 18–35μm. The barrel is always copper; any fill occupies the bore inside it.
pcbThicknessnumbermm0.1 … 101.6PCB thickness (length of the via thermal path)
copperThermalnumberW/m·Kat least 1385Thermal conductivity of the via fill material. Copper: 385, silver: 430, thermal epoxy: 1–5. The plated barrel is copper (385 W/m·K) whatever the fill.
drillFillnumbernone0 … 10Fraction of the bore inside the plating that is filled, from 0 (a hollow plated via) to 1 (fully filled with the material above, copper by default). Copper-filled vias offer the best thermal performance.

Outputs

Returned in values, by key. A value that is unbounded or undefined is null.

Outputs of thermal-via-array
FieldUnitDescription
thetaPerVia°C/WThermal resistance of a single via
thetaArrayheadline°C/WTotal thermal resistance of all vias in parallel: θ_array = θ_via / N
effectiveConductanceW/°CThermal conductance of the array (reciprocal of θ_array)

Calling it

  • Calculate: one call, the request and response in full, and its errors.
  • Batch: this calculator with others, or a sweep, in one request.
  • Solve for a target: the value of one input that brings an output to a target.