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PCB Copper Weight Reference

Copper weight (oz/ft²) to thickness conversion table with current carrying capacity for PCB trace design.

Conversion Formula

Weight to Thickness

1 oz/ft2 = 35 um = 1.37795 mil

General Formula

thickness (um) = weight (oz) x 35

Copper Weight Specifications

WeightThickness (um)Thickness (mil)Thickness (mm)Current @ 1mm*
0.5 oz/ft217.50.6890.01751.2 A
1 oz/ft2351.3780.03502 A
2 oz/ft2702.7560.07003.5 A
3 oz/ft21054.1340.10504.8 A
4 oz/ft21405.5120.14006 A
6 oz/ft22108.2680.21008.2 A

* Current capacity for 1mm trace width, external layer, 10C temperature rise (IPC-2221)

Current Carrying Capacity (IPC-2221)

External layer, 10C temperature rise above ambient. Internal layers carry approximately 50% of these values.

Copper Weight1mm Trace2mm Trace3mm Trace
0.5 oz/ft21.2 A1.9 A2.5 A
1 oz/ft22 A3.2 A4.2 A
2 oz/ft23.5 A5.6 A7.4 A
3 oz/ft24.8 A7.7 A10.2 A
4 oz/ft26 A9.6 A12.7 A
6 oz/ft28.2 A13.1 A17.4 A

Applications by Copper Weight

0.5 oz/ft2(17.5 um / 0.69 mil)
  • ->Fine-pitch BGA routing
  • ->High-density interconnect (HDI) boards
  • ->Smartphone and tablet PCBs
  • ->Inner layers in multilayer boards

Half-ounce copper is standard for HDI and fine-pitch designs. Lower current capacity limits use in power applications. Often paired with 1 oz outer layers.

1 oz/ft2(35 um / 1.38 mil)
  • ->General-purpose digital circuits
  • ->Consumer electronics
  • ->Signal routing layers
  • ->Standard commercial PCBs

Most common copper weight for general PCB fabrication. Good balance of current capacity, cost, and manufacturability. Standard baseline for IPC-2221 calculations.

2 oz/ft2(70 um / 2.76 mil)
  • ->Power distribution layers
  • ->Motor drivers
  • ->LED lighting boards
  • ->Automotive electronics
  • ->Industrial control systems

Double the current capacity of 1 oz copper. Common choice for power planes and high-current traces. Increases board cost by ~20-30%. May require adjusted trace/space rules.

3 oz/ft2(105 um / 4.13 mil)
  • ->High-power DC-DC converters
  • ->Battery management systems (BMS)
  • ->EV/HEV power electronics
  • ->Welding equipment

Heavy copper for demanding power applications. Requires special fabrication capabilities. Minimum trace/space typically 8-10 mil. Often combined with thinner signal layers.

4 oz/ft2(140 um / 5.51 mil)
  • ->Power supply boards
  • ->Busbar replacement
  • ->High-current motor controllers
  • ->Renewable energy inverters

Heavy copper requiring specialty PCB fabrication. Not all fabs support 4 oz+. Expect longer lead times and higher costs. May need edge plating for thermal relief.

6 oz/ft2(210 um / 8.27 mil)
  • ->Extreme power applications
  • ->Planar transformers
  • ->High-current busbars on PCB
  • ->Power conversion equipment

Ultra-heavy copper for extreme power requirements. Very few fabs can process 6 oz+. Often used with embedded busbars or coin insertion for thermal management.

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